Freedom Communications Inc may declare bankruptcy
Submitted by Dominic Haber on Mon, 08/31/2009 - 07:06The Orange County Register's parent, Freedom Communications Inc., may declare bankruptcy this week.
The Wall Street Journal stated that Freedom Communications Inc. has hit an agreement with its lenders, SunTrust, Union Bank of California and JPMorgan Chase to restructure its debts.
US home foreclosure activity soars 32% year-on-year in July
Submitted by Harkamal Singh on Thu, 08/13/2009 - 11:58Going by the latest statistics from the online foreclosure concern RealtyTrac, year-on-year home foreclosure activity for the month of July soared to 32 percent, rising 7 percent from the June numbers.
Qualcomm to make $891-million payment to Broadcom to settle legal dispute
Submitted by Justin Sorkin on Mon, 04/27/2009 - 13:13One of the long-standing disputes over handset-technology patents has been almost settled, with the world's largest mobile-phone chips' maker, Qualcomm Inc agreeing to make a $891-million payment to its Irvine, California-based rival Broadcom Corp, over a four-year period.
Allergan CEO plans acquisitions amid takeover speculations
Submitted by Dominic Haber on Wed, 03/25/2009 - 09:59Though there are speculations abound regarding a prospective sale of the Irvine, California-based cosmetic products-specific company Allergan Inc., the CEO David Pyott said in an interview that the company is itself looking for acquisitions!
Broadcom posts 4Q loss; hopeful of gaining market share in 2009
Submitted by Dominic Haber on Fri, 01/30/2009 - 18:40The Irvine, California-based chip maker Broadcom Corp reported a fourth-quarter loss of $159.2 million, a negative turnaround from its year-before profit of $90.3 million in the same quarter.
Broadcom unveils single-stream 802.11n chip
Submitted by Justin Sorkin on Tue, 12/09/2008 - 12:51The BCM4329, released by Broadcom on Monday, is the latest of its so-called combo wireless chips, designed to bring high-end wireless features to handsets and portable media devices by reducing chip count and overall integration costs.











